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This specification covers refractory silicide sputtering targets for use in microelectronic applications.
Targets shall be classified by the following major constituents: molybdenum silicide, tantalum silicide, titanium silicide, and tungsten silicide.
Target composition shall be stated as the atomic ratio of silicon to metal and shall conform to the prescribed maximum impurity level for:
Dimensional and physical properties such as relative, actual, and theoretical densities are specified. The actual target density shall be determined by Archimedes principle or other acceptable techniques and the theoretical density shall be calculated from the given formula.
The following chemical analytical methods shall be used:
There shall be no radial cracks, other cracks, or chips on the sputtering surface.
1.1 This specification covers sputtering targets fabricated from metallic silicides (molybdenum silicide, tantalum silicide, titanium silicide, and tungsten silicide). These targets are referred to as refractory silicide targets, and are intended for use in microelectronic applications.
1.2 The values stated in SI units are to be regarded as standard. No other units of measurement are included in this standard.
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