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BSI BS 3934-5:1997

Mechanical standardization of semiconductor devices -- Recommendations applying to tape automated bonding (TAB) of integrated circuits
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BSI BS 3934-5:1997

Mechanical standardization of semiconductor devices -- Recommendations applying to tape automated bonding (TAB) of integrated circuits

PUBLISH DATE 1997
PAGES 38
BSI BS 3934-5:1997

This part of IEC 60191 on mechanical standardization gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. This standard is applicable to the finished component supplied by a manufacturer to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).

Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).
SDO BSI: British Standards Institution
Document Number 3934-5
Publication Date Sept. 15, 1997
Language en - English
Page Count
Revision Level
Supercedes
Committee EH/3
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