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BSI BS 4584-103.1:1990

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits -- Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
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BSI BS 4584-103.1:1990

Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits -- Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board

PUBLISH DATE 1990
PAGES 12
BSI BS 4584-103.1:1990

WITHDRAWN, 4/24/2012

Two types of epoxide resin impregnated woven glass fabric with the resin cured to B stage.

SDO BSI: British Standards Institution
Document Number 4584-103.1
Publication Date Feb. 28, 1990
Language en - English
Page Count
Revision Level
Supercedes
Committee EPL/501
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