BSI BS 5664-3.1:1995

Withdrawn Revision
Solventless polymerisable resinous compounds used for electrical insulation. Specification for individual materials -- Unfilled epoxy resinous compounds

Best Price Guarantee Dec 15, 1995 English 1 Pages

This Document Has Been Superseded

A newer publication replaces it: BSI BS EN 60455-3-1


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BSI BS 5664-3.1:1995

Solventless polymerisable resinous compounds used for electrical insulation. Specification for individual materials -- Unfilled epoxy resinous compounds

PUBLISH DATE 1995
BSI BS 5664-3.1:1995

UNFILLED EPOXY RESINOUS COMPOU

Specifies requirements for unfilled epoxy resinous compounds in the cured form for classes EP-U-1 to EP-U-6.

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