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Mechanical standardization of semiconductor devices -- Coding system and classification into forms of package outlines for semiconductor device packages
This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.
The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability.
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