BSI BS EN 60191-6-12:2011

Current Revision
Mechanical standardization of semiconductor devices -- General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)

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BSI BS EN 60191-6-12:2011

Mechanical standardization of semiconductor devices -- General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)

PUBLISH DATE 2011
PAGES 24
BSI BS EN 60191-6-12:2011

IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.

This edition includes the following significant changes with respect to the previous edition:

  • Scope is expanded so that this standard includes the square type FLGA. The title of this standard has been changed accordingly: 'Rectangular type' has been deleted from the title;
  • Ball pitch of 0,3 mm has been added;
  • Datum is changed from the body datum to the ball datum;
  • Combination lists of D, E, MD, and ME have been revised.
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