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BSI BS EN 60191-6-19:2010

Mechanical standardization of semiconductor devices -- Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
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BSI BS EN 60191-6-19:2010

Mechanical standardization of semiconductor devices -- Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

PUBLISH DATE 2010
PAGES 18
BSI BS EN 60191-6-19:2010

This part of IEC 60191 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA).

SDO BSI: British Standards Institution
Document Number EN 60191-6-19
Publication Date June 30, 2010
Language en - English
Page Count
Revision Level
Supercedes
Committee EPL/47
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