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BSI BS EN 60191-6-22:2013

Mechanical standardization of semiconductor devices -- General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
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BSI BS EN 60191-6-22:2013

Mechanical standardization of semiconductor devices -- General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

PUBLISH DATE 2013
PAGES 20
BSI BS EN 60191-6-22:2013
IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
SDO BSI: British Standards Institution
Document Number EN 60191-6-22
Publication Date April 30, 2013
Language en - English
Page Count 20
Revision Level
Supercedes
Committee EPL/47
Publish Date Document Id Type View
April 30, 2013 BS EN 60191-6-22:2013 Revision