BSI BS EN 60191-6-6:2001

Current Revision
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages -- Design guide for fine pitch land grid array (FLGA)

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BSI BS EN 60191-6-6:2001

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages -- Design guide for fine pitch land grid array (FLGA)

PUBLISH DATE 2001
BSI BS EN 60191-6-6:2001

IEC 60191-6-6:2001 provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array (hereinafter called FLGA).

These FLGAs have a terminal pitch that is less than, or equal to, 0.80 mm and have a package body outline that is square.

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