BSI BS EN 60749-10:2002

Withdrawn Consolidated
Semiconductor devices. Mechanical and climatic test methods -- Mechanical shock

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A newer publication replaces it: BSI BS EN IEC 60749-10


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BSI BS EN 60749-10:2002

Semiconductor devices. Mechanical and climatic test methods -- Mechanical shock

PUBLISH DATE 2002
PAGES 8
BSI BS EN 60749-10:2002

Describes a shock test intended to determine the suitability of component parts for use in electronic equipment which may be subjected to moderately severe shocks as a result of suddenly applied forces or abrupt changes in motion produced by rough handling, transportation, or field operation.

Shock of this type may disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test.

It is normally applicable to cavity-type packages.

The contents of the corrigendum of August 2003 have been included in this copy.

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