BSI BS EN 60749-16:2003

Current Consolidated
Semiconductor devices. Mechanical and climatic test methods -- Particle impact noise detection (PIND)

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BSI BS EN 60749-16:2003

Semiconductor devices. Mechanical and climatic test methods -- Particle impact noise detection (PIND)

PUBLISH DATE 2004
PAGES 10
BSI BS EN 60749-16:2003

Defines a test aiming at detecting the presence of loose particles inside a cavity device such as, for example, chips of ceramic, pieces of bonding wire or solder balls (prills).

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