Logo
Login Sign Up
Current Revision

BSI BS EN 60749-21:2011

Semiconductor devices. Mechanical and climatic test methods -- Solderability
Best Price Guarantee
Instant

$286.75

2-5 Days

$286.75

SAVE 10%

$516.15


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


View in Library
or
British Standards Institution Logo

BSI BS EN 60749-21:2011

Semiconductor devices. Mechanical and climatic test methods -- Solderability

PUBLISH DATE 2011
PAGES 26
BSI BS EN 60749-21:2011

This part of IEC 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment.

This test method provides a procedure for ‘dip and look’ solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing.

This test is considered destructive unless otherwise detailed in the relevant specification.

NOTE 1 This test method is in general accord with IEC 60068, but due to specific requirements of semiconductors, the following text is applied.

NOTE 2 This test method does not assess the effect of thermal stresses which may occur during the soldering process. Reference should be made IEC 60749-15 or IEC 60749-20.

SDO BSI: British Standards Institution
Document Number EN 60749-21
Publication Date Aug. 31, 2011
Language en - English
Page Count
Revision Level
Supercedes
Committee EPL/47
Loading...

Failed to load document history.

Publish Date Document Id Type View