BSI BS EN 60749-22:2003

Current Revision
Semiconductor devices. Mechanical and climatic test methods -- Bond strength

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BSI BS EN 60749-22:2003

Semiconductor devices. Mechanical and climatic test methods -- Bond strength

PUBLISH DATE 2003
PAGES 24
BSI BS EN 60749-22:2003

Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements.

The contents of the corrigendum of August 2003 have been included in this copy.

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