Logo
Login Sign Up
Current Revision

BSI BS EN 60749-22:2003

Semiconductor devices. Mechanical and climatic test methods -- Bond strength
Best Price Guarantee
Instant

$319.84

2-5 Days

$319.84

SAVE 10%

$575.71


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


View in Library
or
British Standards Institution Logo

BSI BS EN 60749-22:2003

Semiconductor devices. Mechanical and climatic test methods -- Bond strength

PUBLISH DATE 2003
PAGES 24
BSI BS EN 60749-22:2003
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.
SDO BSI: British Standards Institution
Document Number EN 60749-22
Publication Date July 4, 2003
Language en - English
Page Count
Revision Level
Supercedes
Committee EPL/47
Loading...

Failed to load document history.

Publish Date Document Id Type View