Logo
Login Sign Up
Current Revision

BSI BS EN 60749-25:2003

Semiconductor devices. Mechanical and climatic test methods -- Temperature cycling
Best Price Guarantee
Instant

$228.85

2-5 Days

$228.85

SAVE 10%

$411.93


Sub Total (1 Item(s))

$ 0.00

Estimated Shipping

$ 0.00

Total (Pre-Tax)

$ 0.00


View in Library
or
British Standards Institution Logo

BSI BS EN 60749-25:2003

Semiconductor devices. Mechanical and climatic test methods -- Temperature cycling

PUBLISH DATE 2003
PAGES 16
BSI BS EN 60749-25:2003
Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.
SDO BSI: British Standards Institution
Document Number EN 60749-25
Publication Date Oct. 30, 2003
Language en - English
Page Count
Revision Level
Supercedes
Committee EPL/47
Loading...

Failed to load document history.

Publish Date Document Id Type View