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BSI BS EN 61188-5-4:2007

Printed boards and printed board assemblies. Design and use -- Attachments (land/joint) considerations. Components with J leads on two sides
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BSI BS EN 61188-5-4:2007

Printed boards and printed board assemblies. Design and use -- Attachments (land/joint) considerations. Components with J leads on two sides

PUBLISH DATE 2007
PAGES 18
BSI BS EN 61188-5-4:2007
IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with 'J' leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.
SDO BSI: British Standards Institution
Document Number EN 61188-5-4
Publication Date Dec. 31, 2007
Language en - English
Page Count
Revision Level
Supercedes
Committee EPL/501
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