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BSI BS EN 61189-11:2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Measurement of melting temperature or melting temperature ranges of solder alloys
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BSI BS EN 61189-11:2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Measurement of melting temperature or melting temperature ranges of solder alloys

PUBLISH DATE 2013
PAGES 20
BSI BS EN 61189-11:2013
IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.
SDO BSI: British Standards Institution
Document Number EN 61189-11
Publication Date July 31, 2013
Language en - English
Page Count
Revision Level
Supercedes
Committee EPL/501
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