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BSI BS EN 61189-3-719:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
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BSI BS EN 61189-3-719:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

PUBLISH DATE 2016
PAGES 18
BSI BS EN 61189-3-719:2016

This part of IEC 61189 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

SDO BSI: British Standards Institution
Document Number EN 61189-3-719
Publication Date April 30, 2016
Language en - English
Page Count 18
Revision Level
Supercedes
Committee EPL/501
Publish Date Document Id Type View
April 30, 2016 BS EN 61189-3-719:2016 Revision