BSI BS EN 61189-3-719:2016

Current Revision
Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

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BSI BS EN 61189-3-719:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Test methods for interconnection structures (printed boards). Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

PUBLISH DATE 2016
PAGES 18
BSI BS EN 61189-3-719:2016

This part of IEC 61189 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs).

The purpose is to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.

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