BSI BS EN 61189-5-2:2015

Current Consolidated

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- General test methods for materials and assemblies. Soldering flux for printed board assemblies

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BSI BS EN 61189-5-2:2015

Name: BSI BS EN 61189-5-2:2015 – Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- General test methods for materials and assemblies. Soldering flux for printed board assemblies
Brand: British Standards Institution
SKU: BSI BS EN 61189-5-2:2015
Price: 409.89 USD
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- General test methods for materials and assemblies. Soldering flux for printed board assemblies

PUBLISH DATE 2015

PAGES 46

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.

This part of IEC 61189 focuses on test methods for soldering flux based on the existing IEC 61189-5 and IEC 61189-6. In addition, it includes test methods of soldering flux for lead free soldering.