BSI BS EN 61191-3:2017

Current Revision
Printed board assemblies -- Sectional specification. Requirements for through-hole mount soldered assemblies

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BSI BS EN 61191-3:2017

Printed board assemblies -- Sectional specification. Requirements for through-hole mount soldered assemblies

PUBLISH DATE 2017
PAGES 26
BSI BS EN 61191-3:2017

This part of IEC 61191 prescribes requirements for lead and hole solder assemblies.

The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

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