BSI BS EN 61760-1:2006

Withdrawn Revision
Surface mounting technology -- Standard method for the specification of surface mounting components (SMDs)

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A newer publication replaces it: BSI BS EN IEC 61760-1


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BSI BS EN 61760-1:2006

Surface mounting technology -- Standard method for the specification of surface mounting components (SMDs)

PUBLISH DATE 2006
PAGES 34
BSI BS EN 61760-1:2006

IEC 61760-1:2006-04(en-fr) gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology.

The main changes with regard to the previous edition concern:

  • requirements related to lead-free soldering;
  • extension of the scope to include also components mounted by gluing;
  • direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat;
  • classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.
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