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BSI BS EN IEC 60286-3:2022

Packaging of components for automatic handling -- Packaging of surface mount components on continuous tapes
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BSI BS EN IEC 60286-3:2022

Packaging of components for automatic handling -- Packaging of surface mount components on continuous tapes

PUBLISH DATE 2023
PAGES 64
BSI BS EN IEC 60286-3:2022
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
SDO BSI: British Standards Institution
Document Number IEC 60286-3
Publication Date Jan. 17, 2023
Language en - English
Page Count 64
Revision Level
Supercedes
Committee W/-
Publish Date Document Id Type View
Jan. 17, 2023 BS EN IEC 60286-3:2022 Revision
March 14, 2019 BS EN IEC 60286-3:2019 Revision