BSI BS EN IEC 61189-3-302:2025

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Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

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BSI BS EN IEC 61189-3-302:2025

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

PUBLISH DATE 2025
PAGES 24
BSI BS EN IEC 61189-3-302:2025

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