BSI BS IEC 62047-47:2024

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Semiconductor devices. Micro-electromechanical devices -- Silicon based MEMS fabrication technology. Measurement method of bending strength of microstructures

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BSI BS IEC 62047-47:2024

Semiconductor devices. Micro-electromechanical devices -- Silicon based MEMS fabrication technology. Measurement method of bending strength of microstructures

PUBLISH DATE 2024
PAGES 20
BSI BS IEC 62047-47:2024

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