BSI BS IEC 63011-1:2018

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Integrated circuits. Three dimensional integrated circuits -- Terminology

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BSI BS IEC 63011-1:2018

Integrated circuits. Three dimensional integrated circuits -- Terminology

PUBLISH DATE 2019
PAGES 14
BSI BS IEC 63011-1:2018

IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps.

Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.

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