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Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards.
The purpose of this standard is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles.
In particular, this standard specifies a test method to inspect the occurrence of:
of flexible opto-electric circuit boards under thermal stress.
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