BSI BS IEC 63378-2-1:2024

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Thermal standardization on semiconductor packages -- 3D thermal simulation models of semiconductor packages for steady-state analysis. Discrete packages

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BSI BS IEC 63378-2-1:2024

Thermal standardization on semiconductor packages -- 3D thermal simulation models of semiconductor packages for steady-state analysis. Discrete packages

PUBLISH DATE 2024
PAGES 18
BSI BS IEC 63378-2-1:2024

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