BSI BS EN IEC 63378-6:2026

Current Revision
Thermal standardization on semiconductor packages -- Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

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BSI BS EN IEC 63378-6:2026

Thermal standardization on semiconductor packages -- Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

PUBLISH DATE 2026
PAGES 34
BSI BS EN IEC 63378-6:2026

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