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BSI BS EN IEC 63378-6:2026

Thermal standardization on semiconductor packages -- Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points
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BSI BS EN IEC 63378-6:2026

Thermal standardization on semiconductor packages -- Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points

PUBLISH DATE 2026
PAGES 34
BSI BS EN IEC 63378-6:2026

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SDO BSI: British Standards Institution
Document Number IEC 63378-6
Publication Date March 24, 2026
Language en - English
Page Count 34
Revision Level
Supercedes
Committee EPL/47
Publish Date Document Id Type View
March 24, 2026 BS EN IEC 63378-6:2026 Revision