BSI DD IEC/PAS 62137-3:2008

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Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints

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A newer publication replaces it: BSI BS EN 62137, BSI BS EN 62137-3


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BSI DD IEC/PAS 62137-3:2008

Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints

PUBLISH DATE 2009
PAGES 46
BSI DD IEC/PAS 62137-3:2008

IEC/PAS 62137-3:2008(E) describes the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material.

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