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Printed boards -- Device embedded substrate. Terminology / reliability / design guide
IEC/PAS 62326-14:2010(E) is applicable to device embedded substrates fabricated by embedding discrete active and passive electronic devices into an inner layer of a substrate with electric connections by vias, conductor plating, conductive paste, and printing.
The device embedded substrate may be used as a substrate to mount SMDs to form electronic circuits, as conductor and insulator layers may be formed after embedding electronic devices.
The purpose of this PAS is to obtain common understanding in design, fabrication and use of device embedded substrates in the industry.
This PAS describes the substrate embedding devices including but not limited to:
This PAS does not specify the fabrication process of device embedded substrates, via diameter/via land diameter, conductor width/conductor spacing nor conductor line density.
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