BSI DD IEC/TS 62610-1:2009

Current Revision

Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series -- Design guide. Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)

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BSI DD IEC/TS 62610-1:2009

Name: BSI DD IEC/TS 62610-1:2009 – Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series -- Design guide. Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)
Brand: British Standards Institution
SKU: BSI DD IEC/TS 62610-1:2009
Price: 310.76 USD
Availability: InStock

Mechanical structures for electronic equipment. Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series -- Design guide. Interface dimension and provision for thermoelectrical cooling systems (Peltier effect)

PUBLISH DATE 2010

PAGES 28

This Technical Specification provides guidelines for the installation of thermoelectrical cooling systems (Peltier effect) within cabinets of the IEC 60297 (19 inch) and IEC 60917 (25 mm) series.

The cooling performance is in direct relation with the mounting location within a cabinet.

Three typical mounting locations are identified:

mounting location 1: cabinet with inside or outside mounted thermoelectrical cooling system for the cooling of a whole cabinet;
mounting location 2: cabinet with top mounted thermoelectrical cooling system for the cooling of a whole cabinet;
mounting location 3: cabinet with inbuilt thermoelectrical cooling system in form of a subrack for hot spot cooling.