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BSI PD ES 59008-4-3:2000

Data requirements for semiconductor die. Specific requirements and recommendations -- Thermal
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BSI PD ES 59008-4-3:2000

Data requirements for semiconductor die. Specific requirements and recommendations -- Thermal

PUBLISH DATE 2000
PAGES 12
BSI PD ES 59008-4-3:2000
DATA REQUIREMENTS FOR SEMICONDUCTOR DIE, SPECIFIC REQUIREMEN
Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures and minimally-packaged semiconductor die. Specifies requirements of operational thermal conditions of unpackaged and minimally-packaged semiconductor die. Also gives recommendations for general industry good practice in it's use.
SDO BSI: British Standards Institution
Document Number ES 59008-4-3
Publication Date March 15, 2000
Language en - English
Page Count 12
Revision Level
Supercedes
Committee EPL/47
Publish Date Document Id Type View
March 15, 2000 PD ES 59008-4-3:2000 Revision