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This Document Has Been Superseded
A newer publication replaces it: BSI BS EN 62258-6
Data requirements for semiconductor die. Specific requirements and recommendations -- Thermal
DATA REQUIREMENTS FOR SEMICONDUCTOR DIE, SPECIFIC REQUIREMEN
Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures and minimally-packaged semiconductor die.
Specifies requirements of operational thermal conditions of unpackaged and minimally-packaged semiconductor die.
Also gives recommendations for general industry good practice in its use.
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