BSI PD IEC TR 61189-5-506:2019

Current Revision

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

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BSI PD IEC TR 61189-5-506:2019

Name: BSI PD IEC TR 61189-5-506:2019 – Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
Brand: British Standards Institution
SKU: BSI PD IEC TR 61189-5-506:2019
Price: 310.76 USD
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- General test methods for materials and assemblies. An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501

PUBLISH DATE 2019

PAGES 26

This Technical Report is an intercomparison supporting the development of IEC 61189-5-501 in relation to the SIR method.

This document sets out to validate the introduction of a new 200-µm gap SIR pattern, and was benched marked against existing SIR gap patterns of 318 µm and 500 µm.

BSI PD IEC TR 61189-5-506:2019

BSI PD IEC TR 61189-5-506:2019

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