BSI PD IEC TR 61191-7:2020

Current Revision
Printed board assemblies -- Technical cleanliness of components and printed board assemblies

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BSI PD IEC TR 61191-7:2020

Printed board assemblies -- Technical cleanliness of components and printed board assemblies

PUBLISH DATE 2020
PAGES 118
BSI PD IEC TR 61191-7:2020

This part of IEC 61191 serves as a Technical Report and provides information on how technical cleanliness can be assessed within the electronics assembly industry.

Technical cleanliness concerns sources, analysis, reduction and control as well as associated risks of particulate matter, so-called foreign-object debris, on components and electronic assemblies in the electronics industry.

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