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BSI PD IEC TR 61760-3-1:2022

Surface mounting technology -- Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
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BSI PD IEC TR 61760-3-1:2022

Surface mounting technology -- Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method

PUBLISH DATE 2022
PAGES 30
BSI PD IEC TR 61760-3-1:2022

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SDO BSI: British Standards Institution
Document Number IEC TR 61760-3-1
Publication Date Oct. 31, 2022
Language en - English
Page Count
Revision Level
Supercedes
Committee EPL/501
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