BSI PD IEC TR 61760-5-1:2024

Current Revision
Surface mounting technology -- Surface strain on circuit board. Strain gauge measurement applied to chip components

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BSI PD IEC TR 61760-5-1:2024

Surface mounting technology -- Surface strain on circuit board. Strain gauge measurement applied to chip components

PUBLISH DATE 2024
PAGES 28
BSI PD IEC TR 61760-5-1:2024

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