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BSI PD IEC/TR 62258-7:2007

Semiconductor die products -- XML schema for data exchange
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BSI PD IEC/TR 62258-7:2007

Semiconductor die products -- XML schema for data exchange

PUBLISH DATE 2007
PAGES 28
BSI PD IEC/TR 62258-7:2007

This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structures and minimally or partially encapsulated die and wafers.

This report contains an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2.

It is also complementary to and compatible with the questionnaire in IEC/TR 62258-4.

SDO BSI: British Standards Institution
Document Number IEC/TR 62258-7
Publication Date Nov. 30, 2007
Language en - English
Page Count
Revision Level
Supercedes
Committee EPL/47
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