BSI PD IEC/TR 62866:2014

Current Revision
Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing

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BSI PD IEC/TR 62866:2014

Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing

PUBLISH DATE 2014
PAGES 96
BSI PD IEC/TR 62866:2014

This Technical Report describes the history of the degradation of printed wiring boards caused by electrochemical migration.

It covers the measurement method, observation of the failure, and remarks to testing in detail.

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