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BSI PD IEC TR 62878-2-7:2019

Device embedding assembly technology -- Guidelines. Accelerated stress testing of passive embedded circuit boards
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BSI PD IEC TR 62878-2-7:2019

Device embedding assembly technology -- Guidelines. Accelerated stress testing of passive embedded circuit boards

PUBLISH DATE 2019
PAGES 16
BSI PD IEC TR 62878-2-7:2019

This part of IEC 62878 describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

SDO BSI: British Standards Institution
Document Number IEC TR 62878-2-7
Publication Date April 1, 2019
Language en - English
Page Count
Revision Level
Supercedes
Committee EPL/501
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