BSI PD IEC TR 62878-2-7:2019

Current Revision
Device embedding assembly technology -- Guidelines. Accelerated stress testing of passive embedded circuit boards

Best Price Guarantee Apr 1, 2019 English 16 Pages

Sub Total (1 Item(s)) $ 0.00
Estimated Shipping $ 0.00
Total (Pre-Tax) $ 0.00

You own the digital copy of this edition

View in Library
or
British Standards Institution Logo

BSI PD IEC TR 62878-2-7:2019

Device embedding assembly technology -- Guidelines. Accelerated stress testing of passive embedded circuit boards

PUBLISH DATE 2019
PAGES 16
BSI PD IEC TR 62878-2-7:2019

This part of IEC 62878 describes the accelerated stress testing of passive embedded circuit boards.

It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards.

These boards are mainly for mobile devices.

Loading...

Failed to load document history.

Publish Date Document Id Type View