BSI PD IEC TR 63378-1:2021

Current Revision
Thermal standardization on semiconductor packages -- Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

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BSI PD IEC TR 63378-1:2021

Thermal standardization on semiconductor packages -- Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

PUBLISH DATE 2022
PAGES 24
BSI PD IEC TR 63378-1:2021

BGA, QFP type semiconductor packages.

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