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BSI PD IEC TR 63378-1:2021

Thermal standardization on semiconductor packages -- Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
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BSI PD IEC TR 63378-1:2021

Thermal standardization on semiconductor packages -- Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

PUBLISH DATE 2022
PAGES 24
BSI PD IEC TR 63378-1:2021

BGA, QFP type semiconductor packages.

SDO BSI: British Standards Institution
Document Number IEC TR 63378-1
Publication Date Jan. 11, 2022
Language en - English
Page Count 24
Revision Level
Supercedes
Committee EPL/47
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