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BSI PD IEC/TS 61189-3-301:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Test methods for interconnection structures (printed boards). Appearance inspection method for plated surfaces on PWB
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BSI PD IEC/TS 61189-3-301:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Test methods for interconnection structures (printed boards). Appearance inspection method for plated surfaces on PWB

PUBLISH DATE 2016
PAGES 20
BSI PD IEC/TS 61189-3-301:2016

This part of IEC 61189 outlines a way to determine the appearance non-uniformity of both the *lustre* and *colour* on plated metal surfaces in printed wiring boards (PWBs).

The method is applicable to gold, nickel and copper plating in PWBs.

SDO BSI: British Standards Institution
Document Number IEC/TS 61189-3-301
Publication Date Aug. 31, 2016
Language en - English
Page Count
Revision Level
Supercedes
Committee EPL/501
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