BSI PD IEC/TS 61189-3-301:2016

Current Revision
Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Test methods for interconnection structures (printed boards). Appearance inspection method for plated surfaces on PWB

Best Price Guarantee Aug 31, 2016 English 20 Pages

Sub Total (1 Item(s)) $ 0.00
Estimated Shipping $ 0.00
Total (Pre-Tax) $ 0.00

You own the digital copy of this edition

View in Library
or
British Standards Institution Logo

BSI PD IEC/TS 61189-3-301:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Test methods for interconnection structures (printed boards). Appearance inspection method for plated surfaces on PWB

PUBLISH DATE 2016
PAGES 20
BSI PD IEC/TS 61189-3-301:2016

This part of IEC 61189 outlines a way to determine the appearance non-uniformity of both the *lustre* and *colour* on plated metal surfaces in printed wiring boards (PWBs).

The method is applicable to gold, nickel and copper plating in PWBs.

Loading...

Failed to load document history.

Publish Date Document Id Type View