BSI PD IEC/TS 62647-2:2012

Current Revision
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder -- Mitigation of deleterious effects of tin

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BSI PD IEC/TS 62647-2:2012

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder -- Mitigation of deleterious effects of tin

PUBLISH DATE 2013
PAGES 72
BSI PD IEC/TS 62647-2:2012

This Technical Specification establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems.

This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes.

This document may be used by other high-performance and high-reliability industries, at their discretion.

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