BSI PD IEC/TS 62878-2-4:2015

Current Revision
Device embedded substrate -- Guidelines. Test element groups (TEG)

Best Price Guarantee Apr 30, 2015 English 4 Pages

Sub Total (1 Item(s)) $ 0.00
Estimated Shipping $ 0.00
Total (Pre-Tax) $ 0.00

You own the digital copy of this edition

View in Library
or
British Standards Institution Logo

BSI PD IEC/TS 62878-2-4:2015

Device embedded substrate -- Guidelines. Test element groups (TEG)

PUBLISH DATE 2015
PAGES 4
BSI PD IEC/TS 62878-2-4:2015

This part of IEC 62878 describes the test element group devices useful when measuring basic properties of device embedded substrates.

This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include, for example:

  • active or passive devices,
  • discrete components formed in the fabrication process of electronic wiring board,
  • and sheet formed components.

The IEC 62878 series neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.

Loading...

Failed to load document history.

Publish Date Document Id Type View