IEC 60068-2-82 Ed. 2.0 b:2019

Current Revision

Environmental testing - Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies

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IEC 60068-2-82 Ed. 2.0 b:2019

Name: IEC 60068-2-82 Ed. 2.0 b:2019 – Environmental testing - Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Brand: International Electrotechnical Commission
SKU: IEC 60068-2-82 Ed. 2.0 b:2019
Price: 328.79 USD
Availability: InStock

Environmental testing - Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies

PUBLISH DATE 2019

PAGES 72

Environmental testing - Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies.

IEC 60068-2-82:2019 specifies tests for the whiskering propensity of surface finishes of electric or electronic components and mechanical parts such as punched/stamped parts (for example, jumpers, electrostatic discharge protection shields, mechanical fixations, press fit pins and other mechanical parts used in electronic assemblies) representing the finished stage, with tin or tin-alloy finish.

Changes of the physical dimensions of mould compounds, plastics and the like during the required test flow are not considered or assessed.

The test methods have been developed by using a knowledge-based approach.

This edition includes the following significant technical changes with respect to the previous edition:

Extension of the scope of the test standard from electronic to electromechanic components and press-fit pins, which are used for assembly and interconnect technology;
Significant reduction of the testing effort by a knowledge-based selection of test conditions i.e. tests not relevant for a given materials system can be omitted (see Annex D);
Harmonization with JESD 201A by omission of severities M, N for temperature cycling tests;
Highly reduced test duration (1 000 h instead of 4 000 h) for damp-heat test by introducing test condition at elevated humidity of 85 % R.H. and a temperature of 85 °C providing increased severity.