IEC 60191-4 Ed. 3.1 b:2018

Current Revision

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Best Price Guarantee Mar 1, 2018 EN/FR 158 Pages

PDF Available after processing $518.21 Print Copy Ships in 2-5 Days Quantity: 1 $518.21 Bundle Save 10% Ships in 2-5 Days $932.78

Sub Total (1 Item(s)) $ 0.00

Estimated Shipping $ 0.00

Total (Pre-Tax) $ 0.00

IEC 60191-4 Ed. 3.1 b:2018

Name: IEC 60191-4 Ed. 3.1 b:2018 – Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Brand: International Electrotechnical Commission
SKU: IEC 60191-4 Ed. 3.1 b:2018
Price: 518.21 USD
Availability: InStock

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

PUBLISH DATE 2018

PAGES 158

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages.

IEC 60191-4:2013+A1:2018 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.

The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability.

This edition includes the following significant technical changes with respect to the previous edition:

Material code "S" is added to indicate a silicon based package.
Description of "WL" is added to be used for general use.

This consolidated version consists of the third edition (2013) and its amendment 1 (2018). Therefore, no need to order amendment in addition to this publication.