IEC 60191-6-13 Ed. 2.0 b:2016

Current Revision

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

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IEC 60191-6-13 Ed. 2.0 b:2016

Name: IEC 60191-6-13 Ed. 2.0 b:2016 – Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
Brand: International Electrotechnical Commission
SKU: IEC 60191-6-13 Ed. 2.0 b:2016
Price: 145.53 USD
Availability: InStock

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

PUBLISH DATE 2016

PAGES 40

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in sockets applied to FBGA and FLGA.

This edition includes the following significant technical changes with respect to the previous edition:

BGA package nominal length and width have been newly expanded to 43 mm and 43 mm, respectively.
Accordingly, six socket sizes have been added to the socket group numbers 1, 2 and 3, and twenty-two socket sizes have been added to the socket group number 4.