IEC 60191-6-2 Ed. 1.0 b:2001

Current Revision

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Best Price Guarantee Dec 1, 2001 EN/FR 16 Pages

PDF Instant Access $50.82 Print Copy Ships in 2-5 Days Quantity: 1 $50.82 Bundle Save 10% Ships in 2-5 Days $91.48

Sub Total (1 Item(s)) $ 0.00

Estimated Shipping $ 0.00

Total (Pre-Tax) $ 0.00

IEC 60191-6-2 Ed. 1.0 b:2001

Name: IEC 60191-6-2 Ed. 1.0 b:2001 – Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Brand: International Electrotechnical Commission
SKU: IEC 60191-6-2 Ed. 1.0 b:2001
Price: 50.82 USD
Availability: InStock

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

PUBLISH DATE 2001

PAGES 16

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages.

Design guide for 1.50 mm, 1.27 mm, and 1.00 mm pitch ball and column terminal packages.

IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).