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IEC 60191-6-20 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
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IEC 60191-6-20 Ed. 1.0 b:2010

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

PUBLISH DATE 2026
PAGES 26
IEC 60191-6-20 Ed. 1.0 b:2010
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
IEC 60191-6-20:2010 specifies methods to measure package dimensions of small outline J-lead-packages (SOJ), package outline form E in accordance with IEC 60191-4.
SDO IEC: International Electrotechnical Commission
Document Number IEC 60191
Publication Date April 1, 2026
Language b - English & French
Page Count 26
Revision Level 1.0
Supercedes
Committee 47D
Publish Date Document Id Type View
April 1, 2026 IEC 60191-6-20 Ed. 1.0 b:2010 Revision
Aug. 1, 2010 Revision