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IEC 60191-6-4 Ed. 1.0 b:2003

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
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IEC 60191-6-4 Ed. 1.0 b:2003

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

PUBLISH DATE 2026
PAGES 22
IEC 60191-6-4 Ed. 1.0 b:2003
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
SDO IEC: International Electrotechnical Commission
Document Number IEC 60191
Publication Date April 1, 2026
Language b - English & French
Page Count 22
Revision Level 1.0
Supercedes
Committee 47D
Publish Date Document Id Type View
April 1, 2026 IEC 60191-6-4 Ed. 1.0 b:2003 Revision
June 1, 2003 Revision