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IEC 60191-6-8 Ed. 1.0 b:2001

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
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IEC 60191-6-8 Ed. 1.0 b:2001

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

PUBLISH DATE 2026
PAGES 16
IEC 60191-6-8 Ed. 1.0 b:2001
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP.
SDO IEC: International Electrotechnical Commission
Document Number IEC 60191
Publication Date April 1, 2026
Language b - English & French
Page Count 16
Revision Level 1.0
Supercedes
Committee 47D
Publish Date Document Id Type View
April 1, 2026 IEC 60191-6-8 Ed. 1.0 b:2001 Revision
Aug. 1, 2001 Revision