IEC 60191-6 Ed. 3.0 b:2009

Current Revision

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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IEC 60191-6 Ed. 3.0 b:2009

Name: IEC 60191-6 Ed. 3.0 b:2009 – Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
Brand: International Electrotechnical Commission
SKU: IEC 60191-6 Ed. 3.0 b:2009
Price: 328.79 USD
Availability: InStock

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

PUBLISH DATE 2009

PAGES 80

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

IEC 60191-6:2009 gives general rules for the preparation of outline drawings of surface-mounted semiconductor devices. It supplements IEC 60191-1 and IEC 60191-3.

It covers all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8, as well as integrated circuits classified as form E in Clause 3 of IEC 60191-4.

This third edition of IEC 60191-6 cancels and replaces the second edition, published in 2004, and constitutes a technical revision.

This edition includes the following significant changes with respect to the previous edition:

a) Scope is modified to cover all surface-mounted devices discrete semiconductors with lead count of greater or equal to 8;
b) Editorial modifications on several pages; and
c) Technical revision to ball grid array package (BGA), especially its geometrical drawing format. (Two types of BGA would unify as one type as a result of revising drawing format.)